STIRRI® V3-TF™ – High-Performance No-Clean Tacky Flux for Electronics

All-Purpose Flux for SMT Industry, Rework and Hobby Use

V3-TF is a high-performance, universal no-clean tacky flux designed for a wide range of electronics repair and rework applications. This proven formulation is a reliable solution for both professionals and hobbyists, providing excellent wetting and tack to hold components in place. Its unique blend of rosin and synthetic resin provides the benefits of both materials: the rosin contributes to excellent wetting and tack, while the synthetic resin enhances electrical performance and minimizes residues. It also features our proprietary HX-Booster™ package, which augments halogens for superior oxide stripping that is extremely beneficial for solder paste.

The flux exhibits excellent texture, controlled flow rate, and superior stay-in-place properties during component placement and hot air rework. It features a Visual QC-Aid™ optical tracer that glows in UV for immediate visual detection of residues, and an Olfactory QC-Aid™ tracer that provides a pleasant scent, engaging the sense of smell for the purpose of such detection.

Please note that the halogen booster package used in this formulation may initially appear conductive to ensure superior soldering performance. This temporary conductivity is a characteristic of the unactivated residue, and it can be addressed by adding extra time and heat to the soldering profile or by cleaning the assembly. The activated residue is benign and fully conforms to J-STD-004C for no-clean formulations.

Key Performance Advantages

• Augmented Halogens and Boosters: Unlike many fluxes, V3-TF is engineered for potent oxide stripping action. Its proprietary HX-Booster™ package augments halogens to ensure a clean, strong solder joint, even on difficult-to-solder surfaces.
• Wetting and Wicking Action: It quickly wets leaded or lead-free alloys, delivering perfect shining joints. It delivers a booster for copper ions, providing superior wicking action that draws solder into desoldering wick.
• Excellent Component Hold: Maintains a strong tack to hold components in place, yet allows for easy repositioning with hot air.
• Longevity under Hot Air: Features a slow burning ratio and maintains stable performance under extended exposure to heat without turning into a dark, gooey substance.
• Superior Clarity: Its translucent residue allows for an unobstructed view of solder joints and IC pins, offering ultimate control over the soldering process.
• Non-Corrosive: The flux is non-corrosive, and its activated residue is fully benign and can be left on the PCB.

Application-Specific Design Considerations for Soldering

• Professional and Hobbyist Use: The flux is designed for exceptional performance during hand soldering, providing reliable results for general repair, rework, and prototyping.
• Component Rework: The flux exhibits superior stay-in-place properties, making it ideal for the precise placement and rework of components such as BGA, QFN, LGA, and other surface-mount devices.

Compliance and Standards

• Classification: ROL0 (Halide-free <0.05%)
• Environmental Compliance: RoHS3 and REACH-compliant — gentle on the environment and human health.
• Low VOC: The formulation is designed with a low Volatile Organic Compound content to minimize environmental impact.

Formulation Details

• Rosin/Synthetic Resin Blend: A balanced blend of reprocessed rosin crystal and fully synthetic resin provides excellent soldering performance, minimal residues, and broad alloy compatibility.
• Low-Residue Characteristics: Ideal for applications where cleaning is challenging due to component density, equipment limitations, temperature constraints, or restricted access.

Manufacturing and Application

• Flux Application Method: The flux is designed for use with various modern dispensing equipment, including positive displacement and time/pressure systems, as well as manual application.
• Solder Alloy Compatibility: The flux exhibits excellent compatibility with a wide range of solder alloys, including SnAgCu and SnPb alloys, making it an all-purpose solution.

Ready for Implementation

While V3-TF is a no-clean tacky flux, cleaning may be necessary prior to conformal coating to ensure optimal coating adhesion and long-term reliability, particularly in harsh operating environments. As a supplier of both fluxes and conformal coatings, we can offer expert guidance on selecting the appropriate cleaning procedures and conformal coating materials for your specific application. Contact us to discuss your requirements.

Explore Newer Air-free™ Formulations

While V3-TF offers a proven solution, engineers requiring greater performance for high-volume manufacturing often look for improved cleanability and reduced splatter. For these advanced applications, our next-generation V4-TF flux is the ideal choice. V4-TF features AIRfree™ technology for unmatched homogeneity, which is especially suitable for high-volume manufacturing using sensitive automated industrial dispensing machines. It also utilizes an improved solvent system with a higher boiling point for enhanced longevity under hot air and superior cleanability. To learn more, please refer to the V4-TF product page.

• ROL0 is a Rosin-based flux classification characterized by its very low activity level, making it suitable for high-reliability, no-clean applications. Its activated residue is not corrosive, it is halide-free (<0.05%), and it exhibits high surface insulation resistance. It passes the copper mirror breakthrough test and demonstrates low electrochemical migration (<1 decade drop).

30-50 mPa/s (Malcom @ 10 RPM/25ºC (x 10³mPa/s))

„No-Clean“ bezeichnet die Reinigungsmethode gemäß IPC-Standard und bedeutet nicht, dass das Flussmittel keine Rückstände hinterlässt. No-Clean bedeutet vielmehr, dass das Flussmittel für mehrere aufeinanderfolgende SMT-Baugruppen auf der Leiterplatte verbleiben kann, aber auch keine Korrosion verursacht, wenn es auf unbestimmte Zeit belassen wird. Eine Reinigung kann jedoch notwendig sein und ist wünschenswert. No-Clean-Flussmittel lassen sich leicht mit industriellen Lösungsmitteln in Ultraschallgeräten oder mit handelsüblichen Flussmittelrückstandsentfernern wie STIRRI HydraSweep™ entfernen.

Dieses Produkt enthält kein Dosierset – ein separater Kauf!

Das Dispensing Kit ist ein Zusatzgerät für die manuelle Dosierung, mit dem mit einem Kolben ähnlich wie bei einer medizinischen Spritze ein Druck erzeugt wird.

Luftspritzen für pneumatische Dosiermaschinen verwenden einen Kolbenstopper anstelle eines Kolbens. Entfernen Sie den Kolben nicht, da er die beste Abdichtung bietet und den Kontakt mit Luft verhindert!

Dieses Material ist als REACH-konform zertifiziert – es werden keine Rohstoffe aus der REACH-Einschränkungsliste besonders besorgniserregender Stoffe verwendet.