MT-063 - Sn63Pb37 mid-temp eutectic leaded solder wire NC-core ROL0

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    STIRRI®

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    STIRRI-MT-063 Sn63Pb37 no-clean mid-temp eutectic solder wire NC-core (ROL0) - for soldering electronics

    Medium-Temperature - High Performance: Used for leaded MT assembly processes, requiring balanced mechanical strength and thermal cycling resistance - a standard choice for spacecraft, avionics and defense industries, popular for electronics repair and rework

    Alloy Composition: Features a classic blend of 63% Tin (Sn), 37% Lead (Pb), providing for military-grade drop-resistance and thermal cycling requirements.

    Mid-Range Eutectic Melting Point: Melts and solidifies at 183ºC. (*LIQ and SOL temperature ranges are based on IPC J-STD-006B)

    No-Clean Flux Core: Contains 2.5%-3.3% rosin-based no-clean flux core (based on diameter of the wire) for excellent wetting, minimal residue, and ease of use, ensuring clean and efficient soldering.

    Certified Compliance: Meets IPC J-STD-006B standards for quality and performance, making it a trusted choice for high-temperature and semiconductor applications, packaged in a convenient spool size for practical use.

    Product Description

    Suitability

    Designation

    ROL0 classification - no-clean and not corrosive. Halide-free (<0.05%). Surface insulation resistant. No copper mirror breakthrough. Low electrochemical migration (<1 decade drop)

    Viscosity

    mPa/s (Malcom @ 10 RPM/25ºC (x 10³mPa/s))

    Disclaimer

    The information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having relevant skills at their own risk. Consumers should make their own tests to determine the suitability of each product for their particular process and take safety measures. Manufacturer/resellers assume no liability for results obtained or damages incurred through the application of the data presented.

    Cleaning "No-Clean"

    “No-clean” indicates cleaning method as defined by IPC standard and does not mean that the flux leaves no residue. No-clean rather means that the flux can be left on PCB for several consecutive SMT assemblies but also won’t cause corrosion if left indefinitely. However, cleaning can be necessary and it is desirable. No-clean fluxes are easily removed using industrial solvents in ultrasonic devices or using commercially available flux residue removers like STIRRI HydraSweep™.

    Dispensing Kit

    This product does not include any Dispensing Kit - a separate purchase! 

    Dispensing Kit is an add-on for manual dispensing, used to create a pressure with a plunger similarly to a medical syringe.

    Air syringes intended for pneumatic dispensing machines use a piston stopper instead of a plunger. Do not remove the piston as it delivers the best seal preventing contact with air!

    Compliance

    This material is certified REACH-compliant - does not use any raw materials from the REACH restricted list of substances of high concern.

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    RFQ - Request For Quotation

    You are in good hands!

    Made in the USA to the applicable industry standards 100% customer satisfaction guaranteed!

    Liquid-proof the assembly with Nano-Coating - dries in less than 8 seconds

    STIRRI HydraCoat™ is a liquid repellent making PCB liquid proof, instantly improving assembly value!

    With an impressive droplet contact angle of over 113º, this nonconducting solution creates an invisible hydrophobic shield repelling weather, humidity, moisture - coated PCB continues to function even when fully submerged!

    Broadly suited for consumer devices, automotive circuits, urban and landscaping lightning, LED, medical or electronic devices, marine, boating and yachting industries.

    Dry to touch in less than 8 seconds, self cures in 24 hrs or 10 min in 60ºC chamber.

    STIRRI's Conformal nano-coating ensures end-customer satisfaction while virtually eliminating assembly claims due to environmental or consumer liquid damages.

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