STIRRI-V2-TF™ is a no-clean rosin-based MT soldering tacky paste flux for electronics repair and rework using Hot Air.

Amber-Series tubes to provide for at least 24-months shelf life

No-clean soldering tacky paste flux, rosin-based formulation with pine scent, designed for electronics repair and rework using hot air and MT alloys (Sn60/Sn62/Sn63 Mid-Temp/Military-Tech) and Hot Air station.

V2 solder flux has right amount of solids to withstand moderate Hot Air action to complete the repair without many top-ups which can be a useful time/cost saving feature for professionals soldering all day for a living.

– ROL0 flux classification
– Fine-tuned for Tin/Lead applications by hot air
– Clear residue
– Excellent wetting compatibility on most board finishes
– Doesn’t short components
– Wide process window – continue where you left off at a later time, once heated the flux will flow again

Product keynotes

– Rosin-based, low activity no-clean tacky solder flux specifically designed for hand-operations with leaded alloys – manual Sn/Pb rework with hot-air. Suitable for entry level of training and any basic, readily available amateur soldering tools. Filling the workspace with a distinctive terpene/pine scent.

– Mighty action – a noticeable booster for copper ions while wicking the workspace. Quickly breaks-up lead-free joints preparing workspace for leaded repair. Exceptional wetting – tames tin/lead alloy, puts an operator in control, solder magically flows where it has flow. Excellent tackiness – holds components in-place for “dancing” with hot air. Long process window – continue a project at a later time, once heated the flux will flow again.

– Optimal viscosity – 30-50 (Malcom @ 10 RPM/25°C (x103mPa/s)) allowing smooth flow from a syringe. Halide-free (<0.05%). Surface insulation (SIR) resistant. No copper mirror breakthrough. Low electrochemical migration (<1 decade drop). Loaded with fire-retardant properties step-activated as heat increases.

– ROL0 classification – non-corrosive, doesn’t short circuits, can be left on board for multiple SMT assemblies. Clear residue is best to be removed by hot air, otherwise using foam swab and basic solvents like isopropanol (best practice is to clean all flux residues all the time to avoid board contamination or voltage leakage on circuits with high impedance, also non-activated residue may absorb moisture from air and subsequently cause corrosion).

– Industrial air-syringe intended for pneumatic dispensing machines – to manually control the flow use a dispensing kit (plunger and tip sold separately). Do not remove the piston/stopper! Do not discard the original nozzle cap, tighten the cap while not using the flux – flux may dry out upon extended contact with air. Keep at a room temperature – do not refrigerate.