STIRRI® LF-HF-PT-305: Aerospace & Medical Grade SAC305 Solder Paste

Sn96.5 / Ag3.0 / Cu0.5 • No-Clean • Halogen-Free • Pin-Testable (ROL0)

STIRRI® LF-HF-PT-305 is a high-reliability, ultra-low voiding lead-free solder paste engineered for mission-critical assemblies in the aerospace, defense, and medical sectors. It features a specialized pin-testable residue that allows for immediate ATE (Automated Test Equipment) probing without post-solder cleaning, significantly accelerating production timelines.

Key Technical Advantages:

• Precision Metal Loads:
  • T3 & T4: Optimized at 86% for dispensing and 88.5% for high-density stencil printing.
  • T5 & T6: Specialized at 83% for micro-dispensing and 86% for ultra-fine pitch stencil printing.
• Pin-Testable Efficiency: Soft, non-corrosive residues remain protable for up to 5 days post-reflow, eliminating false failures in high-throughput testing.
• Zero Halogens: Strictly Halide & Halogen-free (EN14582) for long-term electrochemical reliability and REACH compliance.
• Superior Joint Integrity: Engineered for world-class thermal dissipation and minimal signal interference—ideal for high-frequency medical sensors and aerospace gear.

Specifications:

• IPC Designation: ROL0 (No-Clean)
• Alloy: SAC305 (Sn96.5Ag3.0Cu0.5)
• Stencil Life: ~12 Hours
• Compliance: REACH & RoHS Compliant

While designated No-Clean, residues are easily removed using IPA or specialized solvents if required for aesthetic or conformal coating prep.

Key Technical Advantages:

• High-Flow, Low-Pressure Rheology: Engineered as a "soft" paste with lower printing resistance (120-190 mPa·s). This allows for significantly reduced squeegee pressure during printing and lower pneumatic pressure during dispensing, minimizing component displacement on delicate aerospace and medical assemblies.
• Precision Metal Load Optimization: Unlike "all-purpose" market pastes, LF-HF-PT-305 uses application-specific metal loads—88.50-86% for printing to prevent slumping and 86-83% for dispensing to ensure consistent, effortless flow.
• Superior Transfer Efficiency: The optimized viscosity aids in a cleaner release from ultra-fine pitch (T5/T6) stencil apertures, ensuring high-fidelity deposits where traditional "stiff" pastes often stick or skip.
• Tighter Dispensing Control: A controlled dispensing range (100-150 mPa·s) eliminates "tailing" (stringing) common in thinner pastes while remaining fluid enough to prevent needle clogging in micro-dispensing applications.
• Pin-Testable Efficiency: Soft, non-corrosive residues remain probeable for up to 5 days post-reflow, eliminating false failures in high-throughput ATE testing environments.
• Zero Halogens: Strictly Halide & Halogen-free (EN14582) for long-term electrochemical reliability and full REACH/RoHS compliance.
• Superior Joint Integrity: Engineered for world-class thermal dissipation and minimal signal interference—ideal for high-frequency medical sensors and aerospace gear.